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Semiconductor substrate for semiconductor devices comprises metallic surfaces and non-metallic surfaces having a layer with irregularities to increase the adhesion between the non-metallic surfaces and a pressing composition
Semiconductor substrate for semiconductor devices comprises metallic surfaces and non-metallic surfaces having a layer with irregularities to increase the adhesion between the non-metallic surfaces and a pressing composition
Semiconductor substrate comprises metallic surfaces and non-metallic surfaces having a layer with irregularities to increase the adhesion between the non-metallic surfaces and a pressing composition. An independent claim is also included for a process for the production of a semiconductor substrate.
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