首页> 外国专利> PERFORATED ELECTROLYTIC METAL FOIL, PERFORATED ELECTROLYTIC METAL FOIL WITH CARRIER SUBSTRATE AND THEIR PRODUCTION METHODS

PERFORATED ELECTROLYTIC METAL FOIL, PERFORATED ELECTROLYTIC METAL FOIL WITH CARRIER SUBSTRATE AND THEIR PRODUCTION METHODS

机译:渗透性电解金属箔,带载体基质的渗透性电解金属箔及其生产方法

摘要

PPROBLEM TO BE SOLVED: To provide an electrolytic metal foil with an aperture, in which parameters such as the size, shape, position and depth of fine through-holes and the number of the fine through-holes per unit area, etc, can be designed according to the purpose. PSOLUTION: One side of the perforated electrolytic metal foil 1 is determined as a reference plane, and a plurality of fine through-holes 7 that penetrate to the other side are formed almost perpendicularly to the reference plane. Moreover, a carrier substrate and the perforated electrolytic metal foil are bonded together to improve the handleability of the perforated electrolytic metal foil having a plurality of fine through-holes in the thickness direction. In a production method for producing the same, an insulating protrusion is formed on the surface of the carrier substrate, and metal plating is performed on the surface of the carrier substrate on which the insulating protrusion is formed to form the perforated electrolytic metal foil on the surface of the carrier substrate. PCOPYRIGHT: (C)2006,JPO&NCIPI
机译:

要解决的问题:提供一种带孔的电解金属箔,其中的参数如细通孔的大小,形状,位置和深度以及每单位面积的细通孔数量等,可以根据目的设计。

解决方案:将穿孔的电解金属箔1的一侧确定为参考平面,并且几乎垂直于参考平面形成多个穿透到另一侧的细通孔7。此外,将载体基板和多孔电解金属箔粘合在一起,以改善在厚度方向上具有多个细通孔的多孔电解金属箔的可操作性。在其制造方法中,在载体基板的表面上形成绝缘突起,并在形成有绝缘突起的载体基板的表面上进行金属镀敷,从而在其上形成多孔电解金属箔。载体基板的表面。

版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006193825A

    专利类型

  • 公开/公告日2006-07-27

    原文格式PDF

  • 申请/专利权人 MITSUI MINING & SMELTING CO LTD;

    申请/专利号JP20050225740

  • 发明设计人 SATO TETSURO;

    申请日2005-08-03

  • 分类号C25D1/08;C25D1/10;C25D1/20;C25D5/02;C25D7/06;

  • 国家 JP

  • 入库时间 2022-08-21 21:55:46

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