Process for measuring the characteristics of a structure especially on a mask or wafer in semiconductor technology scans the structure in rows in at least two different directions

摘要

A process for measuring and characterizing a structure (30) comprises scanning it in rows to form a characteristic appearance with the structure being scanned in at least two different directions (R1,R2) to give a mean (Aresult) and the characteristic appearance determined. An independent claim is also included for a measuring apparatus for the above process.