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SOLDER RESIST INK COMPOSITION, SOLDER RESIST OBTAINED BY CURING THE COMPOSITION AND METHOD FOR PRODUCING THE SOLDER RESIST
SOLDER RESIST INK COMPOSITION, SOLDER RESIST OBTAINED BY CURING THE COMPOSITION AND METHOD FOR PRODUCING THE SOLDER RESIST
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机译:阻焊油墨组成,通过固化得到的阻焊剂和制备阻焊剂的方法
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摘要
PROBLEM TO BE SOLVED: To provide a solder resist ink composition which has no tackiness, excels in active energy ray sensitivity and can form a pattern by development with a dilute alkaline aqueous solution, after printing the ink on a substrate and evaporating the solvent, and which gives a cured film having satisfactory flexibility, high long-term insulation reliability, excellent adhesion and excellent resistance to electroless gold plating and electroless tinning when heat curing is carried out in a post curing step.;SOLUTION: The solder resist ink composition contains as essential components a specific carboxyl group-containing urethane (meth)acrylate, a carboxyl group-containing (meth)acrylate having an ester bond formed by reacting a (meth)acryloyl group-containing monocarboxylic acid with an epoxy group and containing no urethane bond, a compound having two or more epoxy groups and an organic solvent. A solder resist obtained by curing the composition and a method for producing the solder resist are also provided.;COPYRIGHT: (C)2007,JPO&INPIT
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