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Use of ellipsometry and surface plasmon resonance in monitoring thin film deposition or removal from a substrate surface
Use of ellipsometry and surface plasmon resonance in monitoring thin film deposition or removal from a substrate surface
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机译:椭圆偏振法和表面等离子体共振在监测薄膜沉积或从基材表面去除中的应用
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摘要
Improved methodology for monitoring deposition or removal of material to or from a process and/or wittness substrate which demonstrates a negative e1 at some wavelength. The method involves detection of changes in P-polarized electromagnetism ellipsometric DELTA at SPR Resonance Angle-of-Incidence (AOI) to monitor deposition of and/or removal of minute amounts of materials onto, or from, said process and/or witness substrate. The methodology can optionally monitor ellipsometric PSI, and involves simultaneously or sequentially applying non-P-polarized electromagnetism at the same angle of incidence, or electromagnetic radiation of any polarization at a different angle-of-incidence and wavelength to the process or wittness substrate and application of conventional ellipsometric analysis.
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