Hot spot spray cooling (related application) it is not (the description regarding research or the development with the support of Federal Government) the origin of support of government you could do this invention, by the #F33615-03-M-2316 contract which is ordered depending upon the air force laboratory. Government has fixed right in this invention.

摘要

This invention is the spray cooling heat control system which cools the electronic part which creates the heat of the various quantities over the surface. The coolant is distributed on the surface of the electronic part. The territory of the tip/chip which generates the big thermal current, in the territory where it is called the core typically, as for the coolant, it is distributed as continuous spray liquid drop pattern. This spraying pattern forms the hot fluid transpirtation cooling thin film with respect to the core territory of 1 or more. This invention than spraying pattern and the optimization of the flow which are based on complete thin film evaporation, optimizes the spraying pattern which aims toward maximum heat removal ratio. The surplus fluid which flows out to outside from the hot spot and does not evaporate the thermal current where the electronic part is lower by the fact that the cooling thick film is formed on the electronic part (the core is not) is used in order to cool the territory.