CONDUCTIVE PASTE COMPOSITION FOR VIA HOLE FILLING, PRINTED BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE PRINTED BOARD

摘要

Disclosed is a conductive paste composition for via hole filling, which contains 30-70% by volume of a conductive particle having an average particle diameter of 0.5-20 μm and a specific surface area of 0.05-1.5 m2/g, and 70-30% by volume of a resin which contains not less than 10% by weight of an epoxy compound having one or more epoxy groups in a molecule, wherein the total amount of hydroxy groups, amino groups and carboxyl groups is not more than 5% by mole of the epoxy groups and the epoxy equivalent is 100-350 g/eq. This conductive paste composition for via hole filling contains chlorine in an amount of 20-2000 ppm.