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Method for producing semiconductor element, involves forming memory layer sequence on support, which has lower dielectric layer, charge trapping layer and upper dielectric layer

机译:半导体元件的制造方法涉及在支撑体上形成存储层序列,该支撑体序列具有下部电介质层,电荷俘获层和上部电介质层。

摘要

The method involves forming a memory layer sequence (5) on the support (1), which has a lower dielectric layer (2), a charge trapping layer (3) and an upper dielectric layer (4). A periodically structured layer is made of two materials (10) over the support made of a third material. The latter material and the third material are taken away with respect to the former material (10). The other structured layer coats two portions of the materials and releases a portion of the latter material, where the structured layers are used as masks.
机译:该方法包括在支撑体(1)上形成存储层序列(5),该支撑体具有下部介电层(2),电荷俘获层(3)和上部介电层(4)。周期性结构化的层在由第三材料制成的支撑件上由两种材料(10)制成。后一种材料和第三种材料相对于前一种材料(10)被带走。另一个结构化层涂覆材料的两部分并释放后者的一部分,其中结构化层用作掩模。

著录项

  • 公开/公告号DE102007014690B3

    专利类型

  • 公开/公告日2008-07-03

    原文格式PDF

  • 申请/专利权人 QIMONDA AG;

    申请/专利号DE20071014690

  • 发明设计人 CASPARY DIRK;

    申请日2007-03-27

  • 分类号H01L21/76;H01L21/8247;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:22

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