EXTERNAL LEAD OF ELECTRONIC COMPONENT AND PLATING METHOD OF THE EXTERNAL LEAD

摘要

PROBLEM TO BE SOLVED: To provide an external lead of an electronic component, in which the generation of whisker in a plated layer can be suppressed even if the plated layer is a pure tin plated layer formed not only on a lead base material formed from copper or an copper alloy but also on a lead base material formed from an iron-nickel alloy; and to provide a method for manufacturing the same.;SOLUTION: In the external lead 14 of an electronic component, having double plated layers on a prescribed lead base material 16, one layer of the double plated layers is composed of a glossy tin plated layer 18 and the other layer is composed of a matte tin plated layer 20.;COPYRIGHT: (C)2009,JPO&INPIT