ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL

摘要

An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm² to 100 kgf/mm² and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure. The electro-deposited copper foil is suitable for manufacturing TAB substrate having a flying lead as shown in the figure.