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ELECTRIC SIGNAL INTERFACE APPARATUS, CAPABLE OF REMOVING INTERFACE FAILURE BETWEEN PROBE AND PAD AND BETWEEN PROBE AND CIRCUIT BOARD REGARDLESS OF RELATIVE POSITION MISMATCH BETWEEN PROBE AND PAD
ELECTRIC SIGNAL INTERFACE APPARATUS, CAPABLE OF REMOVING INTERFACE FAILURE BETWEEN PROBE AND PAD AND BETWEEN PROBE AND CIRCUIT BOARD REGARDLESS OF RELATIVE POSITION MISMATCH BETWEEN PROBE AND PAD
PURPOSE: An electric signal interface apparatus is provided to improve convenience as a test apparatus, by assembling a probe unit or installing a probe support body on the circuit board using a screw.;CONSTITUTION: A conductive pattern consisting of a conductor including a probe function is formed on a resin film by etching a metallic film using the resin film attached with the metallic film. A probe unit(704) is supported by plural supporting plates by arranging plural resin film type probes in parallel. The plural resin film type probes correspond to a pad of one or plural semiconductor chips to be tested. A first probe holder(705) of lattice form installs plural openings. A second probe holder(706) has a protruded part at the cross point of lattices in the same type as the first probe holder. The probe unit is independently arranged and fixed at every opening.;COPYRIGHT KIPO 2010
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