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Level posture sensing chip and its manufacturing method, level posture sensor

机译:水平姿态传感器芯片及其制造方法,水平姿态传感器

摘要

The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes: a semiconductor substrate; two sets of arm thermosensitive fuses formed on the surface of the semiconductor substrate, each set of the thermosensitive fuses including two thermosensitive fuses in parallel to each other, the two sets of thermosensitive fuses being vertical to each other; electrodes formed at the two ends of the thermosensitive fuses. For the level posture sensing chip and sensor provided by the present invention, the parallelism and verticality of the thermosensitive fuses is high in precision such that the more accurate measurement can be implemented.
机译:本发明公开了一种气摆式水平姿态感测芯片及其制造方法和水平姿态传感器。气摆式水平姿态感测芯片包括:半导体基板;在半导体衬底的表面上形成两组臂式热敏熔断器,每组热敏熔断器包括彼此平行的两个热敏熔断器,两组热敏熔断器彼此垂直。电极形成在热敏保险丝的两端。对于本发明提供的水平姿态感测芯片和传感器,热敏保险丝的平行度和垂直度的精度很高,从而可以实现更精确的测量。

著录项

  • 公开/公告号US8198164B2

    专利类型

  • 公开/公告日2012-06-12

    原文格式PDF

  • 申请/专利权人 FUXUE ZHANG;

    申请/专利号US201113089640

  • 发明设计人 FUXUE ZHANG;

    申请日2011-04-19

  • 分类号H01L21/336;H01L21/82;

  • 国家 US

  • 入库时间 2022-08-21 17:30:34

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