SUBSTRATE BONDING APPARATUS AND A SUBSTRATE MACHINING APPARATUS HAVING A SUBSTRATE BONDING APPARATUS AND A SUBSTRATE THINNING APPARATUS, CAPABLE OF PERFORMING A BONDING AND POLISHING THE SUBSTRATE AT THE SAME TIME

摘要

PURPOSE: A substrate bonding apparatus and a substrate machining apparatus having a substrate bonding apparatus and a substrate thinning apparatus are provided to improve the effectiveness of a bonding process by dotting an adhesive in the contact side of the substrate.;CONSTITUTION: A plurality of cassette ports(110,112) loads a sapphire substrate. A port robot(120) transfers a substrate to the cassette port by using a robot arm. An aligner(130) aligns the ceramics disk and the substrate. A spin coater(150) dots an adhesive on at least contact side of the ceramics disk and the sapphire substrate. A spin coater comprises an adhesive dotting module(160) dotting the adhesive.;COPYRIGHT KIPO 2012