CHIP BONDING APPARATUS EQUIPPED WITH A HEAT TRANSMISSION DELAY ELEMENT AND A CHIP BONDING METHOD USING THE SAME CAPABLE OF SECURING PLENTY OF TIME FOR A BONDING OPERATION

摘要

PURPOSE: A chip bonding apparatus equipped with a heat transmission delay element and chip bonding method using the same are provided to reduce fraction defective by slowly heating a transferred chip.;CONSTITUTION: A pressurization member(30) transfers heat and pressure to a chip which is welded to a substrate. A heat transmission delay element(40) is adsorbed to the bottom of the pressurization member. The heat transmission delay element delays the speed that the heat of the pressurization member is transferred to the chip. A third suction path is extended from the heat transmission delay element. A suction hole(42a) is formed in the inner side of the heat transmission delay element. The suction hole is adsorbed to a chip settled at a stage(10) or the chip which is welded to the substrate.;COPYRIGHT KIPO 2012