OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME WITH REFLECTION MEMBER, OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME, OPTICAL SEMICONDUCTOR LEAD FRAME SUBSTRATE, OPTICAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF OPTICAL SEMICONDUCTOR DEVICE LEAD FRAME WITH REFLECTION MEMBER AND OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor device lead frame with a reflection member, an optical semiconductor device lead frame, an optical semiconductor lead frame substrate, an optical semiconductor device, a manufacturing method of an optical semiconductor device lead frame with a reflection member and an optical semiconductor device manufacturing method, which has high reflectance and excellent heat radiation performance while ensuring insulation properties between a reflector and a lead part (electrode part) of a lead frame even when a metal reflector and a metal lead frame are used.;SOLUTION: Insulation properties between a metal lead frame and a metal reflector are ensured by forming a lead part (electrode part) of the metal lead frame as a multi-level structure and filling a part forming a level difference with an insulating resin. Meanwhile, the above-described problem is solved by fastening a die pad part (element mounting part) of the metal lead frame and the metal reflector by pressure bonding.;COPYRIGHT: (C)2013,JPO&INPIT