The blendinging grain for temperature conductivity resin compound temperature conductivity resin compact heat dissipation sheet, the spherical alumina grain of the temperature conductivity resin compound temperature conductivity resin compact heat dissipation sheet,

摘要

PROBLEM TO BE SOLVED: To provide a highly heat-conductive resin compound capable of producing heat-releasing sheets which have both high heat conductivity and low sheet hardness excellent in flexibility, to provide a highly heat-conductive resin molded article, to provide compounding particles for heat-releasing sheets, to provide a highly heat-conductive resin compound, to provide a highly heat-conductive resin molded article, to provide a heat-releasing sheet, and to provide a method for producing the same.;SOLUTION: The highly heat-conductive resin compound, the highly heat-conductive resin molded article, the compounding particles for heat-releasing sheets, the highly heat-conductive resin compound, the highly heat-conductive resin molded article, the heat-releasing sheet, and the method for producing the same, are each characterized by containing 60 to 80 vol.% of spherical alumina particles having an average particle diameter of 50 to 100 m, 5 to 30 vol.% of spherical alumina particles having an average particle diameter of 0.5 to 7 m, and 10 to 35 vol.% of non-spherical alumina particles having an average particle diameter of 0.5 to 7 m.;COPYRIGHT: (C)2008,JPO&INPIT