FIELD: chemistry.;SUBSTANCE: invention relates to a phenol resin-based adhesive composition and use thereof for moulds and mould cores. The phenol resin-based adhesive composition for moulds or mould cores contains alkaline phenol resin, an alkali and a curing agent. The alkaline phenol resin is obtained by substituting part of the phenol with bisphenol A; molar ratio of bisphenol A to phenol ranges from 1:15 to 1:20, wherein the alkali consists of potassium hydroxide and sodium hydroxide; molar ratio of the sum of potassium hydroxide and sodium hydroxide to phenol ranges from 1.5:1 to 2.5:1, molar ratio of potassium hydroxide to phenol ranges from 0.5:1 to 2.4:1, and molar ratio of sodium hydroxide to phenol ranges from 0.1:1 to 2.0:1. A version of the adhesive composition is also disclosed.;EFFECT: disclosed composition can improve anti-water absorption properties of the mould and core stored after air passage, and increase strength at high temperature of the mould and core stored after air passage.;6 cl, 6 tbl, 7 ex
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