Smart card module for e.g. electronics field, has chip arranged between base layer and layer e.g. double sided printed circuit board, and in recess of base layer, where adhesive establishes interconnection between contacts of chip and layer

摘要

The module has a chip (100) provided with electric contacts and arranged between a base layer (200) and a layer (250) e.g. double sided printed circuit board (400) and prepreg layer. A conductive adhesive is arranged between the base layer and the layer. The electric contacts of the chip are in contact with electric contacts (500) of the layer. The adhesive establishes a permanent electrical interconnection between the electric contacts of the chip and the layer. The chip is arranged in a recess of the base layer. The chip is fastened on the base layer by the adhesive. The conductive adhesive is isotropic conductive adhesive and anisotropic conductive adhesive. The base layer is a monolayer. An independent claim is also included for a method for manufacturing a smart card module.