首页> 外国专利> Method for Reducing Thickness of Interfacial Layer, Method for Forming High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Oxide Film, and Transistor Having High Dielectric Constant Gate Oxide Film

Method for Reducing Thickness of Interfacial Layer, Method for Forming High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Oxide Film, and Transistor Having High Dielectric Constant Gate Oxide Film

机译:减小界面层厚度的方法,高介电常数栅极绝缘膜的形成方法,高介电常数栅极绝缘膜,高介电常数栅极氧化膜以及具有高介电常数栅极氧化膜的晶体管

摘要

To provide a method for reducing a thickness of an interfacial layer, which contains: (a) forming a film of an oxide of a first metal on a semiconductor layer via an oxide film of a semiconductor serving as an interfacial layer; and (b) forming a film of an oxide of a second metal on the film of the oxide of the first metal, where the second metal has higher valency than that of the first metal.
机译:提供一种减小界面层的厚度的方法,该方法包括:(a)经由用作界面层的半导体的氧化膜在半导体层上形成第一金属的氧化物的膜; (b)在第一金属的氧化物膜上形成第二金属的氧化物膜,其中第二金属的化合价高于第一金属的化合价。

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