Device for improving sound in audio instrument e.g. headphone, has dome exhibiting opening in which hologram is introduced, and chip superimposed under dome, which is arranged with zone and exhibits thickness less than that of case

摘要

The device has a dome (1) exhibiting an opening (2) in which a hologram (5) is introduced, and a chip (4) superimposed under the dome. The dome is arranged with a zone on a part of a case (3), where the zone has a thickness that is less than thickness of the case. An edge of the dome is arranged to move away from the hologram and the chip. The chip and the case are provided with a notched part. An axis of the opening is tilted with regard to the bottom of the case. An end of the chip abuts in its rest position under the action of the hologram.