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Thermally driven workload scheduling in heterogeneous multiprocessor system on chip

机译:异构多处理器片上系统中的热驱动工作负载调度

摘要

Various embodiments of methods and systems for thermal recognition scheduling of workloads in portable computing devices including heterogeneous multiprocessor system-on-chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous multiprocessor SoC can exhibit different processing efficiencies at a given time, and because two or more of the processing components can have the ability to process a given code block In order to optimize quality of service (“QoS”) by allocating workloads in real-time or near real-time to the processing components that are in the best situation to process code blocks efficiently, Thermal recognition workload scheduling techniques can be utilized that compare performance curves at their measured operating temperatures.
机译:公开了用于在包括异构多处理器片上系统(“ SoC”)的便携式计算设备中对工作负载进行热识别调度的方法和系统的各种实施例。因为异构多处理器SoC中的各个处理组件可以在给定时间表现出不同的处理效率,并且因为两个或多个处理组件可以具有处理给定代码块的能力,以便优化服务质量(“ QoS”)通过将实时或接近实时的工作负载分配给处于最佳状况的处理组件以有效地处理代码块,可以利用热识别工作负载调度技术来比较在其测得的工作温度下的性能曲线。

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