PROCESSES AND INTEGRATED SYSTEMS FOR ENGINEERING A SUBSTRATE SURFACE FOR METAL DEPOSITION

摘要

This embodiment electro-migration improves performance, provides a lower metal resistivity, copper interconnect for connection to a metal-to-metal or a silicon-to-metal to improve the metal surface adhesion-to-metal or a silicon-to provide a process and an integrated system to produce a metal surface. Copper on the copper surface in an integrated system to improve the electromigration performance of the interconnection cobalt - is an exemplary method is provided for making the surface of the substrate to selectively deposit a thin film of the alloy material. The method includes the step of conditioning the surface of the substrate by using the re-reducing environment and remove the contaminants from the metal oxide phase, and an integrated system for removing contaminants and metal oxides from the substrate surface in an integrated system. The method further includes a re-conditioning of the substrate surface and on the copper surface of the copper wiring in the integrated system, a cobalt-comprising the step of selectively depositing a thin layer of the alloy material. The system for performing the above-described exemplary method is also provided ; electro-migration, metal resistivity, copper interconnects, integrated system, a cobalt-alloy material