Solder resist ink, and a cured product and a printed wiring board using the same

摘要

PROBLEM TO BE SOLVED: To provide: ink for solder resist which can be preferably used as a solder resist and is superior from the viewpoint of a high thermal conductivity and a heat dissipation property; a hardened material thereof; and a printed wiring board arranged by use such ink.;SOLUTION: Ink for solder resist comprises: granular inorganic filler; and a thermosetting resin composition. The inorganic filler accounts for 50-80 vol.%. The inorganic filler includes aluminum nitride subjected to waterproofing and includes, by weight percentage, 50-70 wt.% of particles having a median diameter of 10-25 μm, 20-32 wt.% of particles having a median diameter of 2-8 μm, and 3-25 wt.% of particles having a median diameter of 0.1-2 μm. Thus, ink for solder resist superior from the viewpoint of a high thermal conductivity and a heat dissipation property, a hardened material thereof, and a printed wiring board arranged by use such ink can be provided.;COPYRIGHT: (C)2015,JPO&INPIT