Disclosure of the Invention Problems to be Solved by the Invention A problem to be solved by the present invention is to provide a Cu-Mn alloy film which can cope with a new requirement of low reflection in an electrode film or a wiring film, which is required for improving the display quality of a high- And a method of forming a Cu-Mn alloy sputtering target material and a Cu-Mn alloy film. The metal component is a Cu-Mn alloy film containing 32 to 45 atom% of Mn and a remaining amount of Cu and inevitable impurities and having a visible light reflectance of 30% or less when the entire metal component is taken as 100 atomic% And is suitable for an electrode film or wiring film for a display element.
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