首页> 外国专利> METAL DEPOSITION SOURCE ASSEMBLY AND METAL DEPOSITION APPARATUS INCLUDING SAME

METAL DEPOSITION SOURCE ASSEMBLY AND METAL DEPOSITION APPARATUS INCLUDING SAME

机译:金属沉积物源组件和金属沉积物设备,包括相同的

摘要

The present invention relates to a metal evaporation source assembly for depositing a metal thin film on a substrate. The metal deposition source assembly comprises: a housing; a crucible provided in the housing to receive a deposition material; a heater installed between the housing and the crucible to heat the crucible; a nozzle provided in an upper part of the housing to guide a path through which an evaporated deposition material is sprayed toward the substrate; and a bead layer disposed on the deposition material and including a plurality of beads to pass the deposition material through the beads. Therefore, the metal evaporation source assembly can prevent a phenomenon that a liquid deposition material bounds toward the substrate or the nozzle.;COPYRIGHT KIPO 2017
机译:金属蒸发源组件技术领域本发明涉及一种用于在基板上沉积金属薄膜的金属蒸发源组件。金属沉积源组件包括:外壳;设置在壳体中以容纳沉积材料的坩埚;安装在壳体和坩埚之间的加热器,用于加热坩埚;设置在壳体的上部中的喷嘴,用于引导向基板喷射蒸发的沉积材料的路径;珠层,其设置在沉积材料上并且包括多个珠,以使沉积材料穿过珠。因此,金属蒸发源组件可以防止液体沉积材料朝向基板或喷嘴结合的现象。; COPYRIGHT KIPO 2017

著录项

  • 公开/公告号KR20170096265A

    专利类型

  • 公开/公告日2017-08-24

    原文格式PDF

  • 申请/专利权人 SAMSUNG DISPLAY CO. LTD.;

    申请/专利号KR20160017221

  • 申请日2016-02-15

  • 分类号H01L51/56;H01L21/22;H01L21/28;H01L21/283;H01L51/00;

  • 国家 KR

  • 入库时间 2022-08-21 13:26:45

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