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Method for estimating potential distribution and device for estimating potential distribution

机译:估计电位分布的方法和估计电位分布的装置

摘要

PROBLEM TO BE SOLVED: To provide an estimation method of a potential distribution capable of more precisely estimating the potential distribution of a metallic plate surface from which a current flows out to the external environment.SOLUTION: An estimation method of a potential distribution is a method configured to estimate a potential distribution of a top surface when a surface of a metallic plate from which a current flows out to the external environment is defined as the top surface and the other surface thereof is defined as the rear surface. The method obtains a potential distribution of the rear surface by measurement, and determines a position of an extreme point of the rear surface and a position of an electric conduction point of the top surface from the potential distribution of the rear surface obtained by the measurement, obtains the potential distributions of the top surface and the rear surface from the potential distribution of the metallic plate obtained by a numerical value calculation with the potential of a feeding point provided on the electric conduction point and the metallic plate as a boundary condition, and performs a comparison with the electric potential of the extreme point in the potential distribution of the rear surface obtained by the numerical value calculation and the electric potential of the extreme point in the potential distribution of the rear surface obtained by the measurement, and when a ratio of the electric potential of the extreme point by the measurement to the potential of the extreme point by the measurement is within an allowable range, the potential distribution of the top surface by the numerical value calculation is estimated as the potential distribution of the metallic plate surface.SELECTED DRAWING: Figure 3
机译:解决的问题:提供一种电位分布的估计方法,该方法能够更精确地估计电流从其流出到外部环境的金属板表面的电位分布。解决方案:电位分布的估计方法是一种方法当电流从其流出到外部环境的金属板的表面被定义为顶表面并且其另一表面被定义为后表面时,被构造为估计顶表面的电位分布。该方法通过测量获得后表面的电势分布,并根据通过测量获得的后表面的电势分布来确定后表面的极限点的位置和顶表面的导电点的位置,从通过数值计算获得的金属板的电势分布,以设置在导电点和金属板上的馈电点的电势作为边界条件,获得顶表面和后表面的电势分布,并执行与通过数值计算获得的背面的电位分布中的极点电位与通过测量获得的背面的电位分布中的极点电位进行比较,以及极点电位通过测量到外部电位通过测量的eme点在允许范围内,通过数值计算将顶表面的电势分布估计为金属板表面的电势分布。图3

著录项

  • 公开/公告号JP6579132B2

    专利类型

  • 公开/公告日2019-09-25

    原文格式PDF

  • 申请/专利权人 JFEスチール株式会社;

    申请/专利号JP20170038951

  • 发明设计人 渡辺 裕一;赤塚 隆男;

    申请日2017-03-02

  • 分类号G01N27/26;G01R29/14;

  • 国家 JP

  • 入库时间 2022-08-21 12:20:29

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