Electrochemical bath for the electrochemical deposition of a Cu-Sn-Zn-Pd alloy, procedure for the electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

摘要

The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermediate layer (e.g. a Pd-layer) between the substrate and the finishing layer is no longer necessary which allows a substantial reduction of the production costs of the plated substrates.