THERMAL CONDUCTANCE MEASUREMENTS OF PRESSED OFHC COPPER CONTACTS AT LIQUID HELIUM TEMPERATURES

摘要

THE THERMAL CONDUCTANCE OF OXYGEN-FREE HIGH CONDUCTIVITY (OFHC) COPPER SAMPLE PAIRS WITH SURFACE FINISHES RANGING FROM 0.1 TO 1.6-MICROMETERS RMS ROUGHNESS WAS INVESTIGATED OVER THE RANGE OF 1.6 TO 6.0-K UNDER APPLIED CONTACT FORCES UP TO 670 N. THE THERMAL CONDUCTANCE INCREASES WITH INCREASING CONTACT FORCE; HOWEVER, NO CORRELATION CAN BE DRAWN WITH RESPECT TO SURFACE FINISH.