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Wetting studies on Au nanowires deposited through nanostencil masks

机译:通过纳米模板掩模沉积的金纳米线的润湿研究

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摘要

We present for the first time TEM cross-section studies of Au nanowires fabricated with nanostencil membranes. Au metallic nanowires from 100 to 20 nm in width are fabricated on metallic, semiconducting and insulating substrates. The observed profiles require consideration of wetting for a satisfactory understanding. This length scale is easily accessible by simulations, thereby making it possible to model the cross-section profiles. In addition, the fabrication capabilities of the nanostencil technique are thus critically evaluated for the fabrication of metallic nanowires on different substrates up to 20 nm linewidths. We find a clear separation between spreading-dominated and wetting-dominated behaviour. Substrates such as HOPG and mica aid spreading. The 1: 1 geometrical reproduction rule is well respected in the wetting case down to the 20 nm limit, before the clogging of the mask on all other substrates.
机译:我们首次提出用纳米模板膜制作的金纳米线的TEM截面研究。在金属,半导体和绝缘基板上制造宽度为100至20 nm的金纳米线。为了令人满意的理解,观察到的轮廓需要考虑润湿。通过仿真可以轻松访问此长度刻度,从而可以对横截面轮廓进行建模。此外,因此对于在高达20 nm线宽的不同基板上制造金属纳米线,必须严格评估纳米模板技术的制造能力。我们发现在以扩散为主的行为和以湿为主的行为之间存在明显的区别。诸如HOPG和云母之类的底物有助于扩散。在润湿情况下,在所有其他基材上都没有掩膜堵塞之前,应遵循1:1的几何复制规则。

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