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机译:
Med Univ Warsaw, Dept Orthodont, Nowogrodzka 59, PL-02006 Warsaw, Poland;
Mil Univ Technol, Dept Chem, Gen Sylwestra Kaliskiego 2, PL-00908 Warsaw, Poland;
orthodontic adhesives; photopolymerization; degree of conversion; statistical analysis;
机译:The effect of resin formulation on the degree of conversion and mechanical properties of dental restorative resins
机译:Use of an adhesive resin for bonding orthodontic brackets
机译:Assessment of Shear Bond Strength and Cytotoxicity of Orthodontic Adhesive with Addition of Silver Nanoparticles in Varying Concentrations
机译:360-degree assessment system: its application in Hong Kong.