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GaN microring waveguide resonators bonded to silicon substrate by a two-step polymer process

机译:GaN微行波导谐振器通过两步聚合物工艺粘合到硅衬底上

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摘要

Using a polymer bonding technique, GaN microring waveguide resonators were fabricated on a Si substrate for future hybrid integration of GaN and Si photonic devices. The designed GaN microring consisted of a rib waveguide having a core of 510 nm in thickness, 1000 nm in width, and a clad of 240 nm in thickness. A GaN crystalline layer of 1000 nm in thickness was grown on a Si(111) substrate by metal organic chemical vapor deposition using a buffer layer of 300 nm in thickness for the compensation of lattice constant mismatch between GaN and Si crystals. The GaN/Si wafer was bonded to a Si(100) wafer by a two-step polymer process to prevent it from trapping air bubbles. The bonded GaN layer was thinned from the backside by a fast atom beam etching to remove the buffer layer and to generate the rib waveguides. The transmission characteristics of the GaN microring waveguide resonators were measured. The losses of the straight waveguides were measured to be 4.0 +/- 1.7 dB/mm around a wavelength of 1.55 mu m. The microring radii ranged from 30 to 60 mu m, where the measured free-spectral ranges varied from 2.58 to 5.30 nm. The quality factors of the microring waveguide resonators were from 1710 to 2820. (c) 2018 Optical Society of America
机译:使用聚合物键合技术,在Si衬底上制造GaN微耦合波导谐振器,用于GaN和Si光子器件的未来杂种集成。所设计的GaN微管由肋波导组成,厚度为510nm,宽1000nm,厚度为240nm的包层。通过使用300nm的缓冲层在厚度为300nm的厚度的金属有机化学气相沉积在Si(111)衬底上生长在Si(111)衬底上生长,用于补偿GaN和Si晶体之间的晶格恒定不匹配。通过两步聚合物方法将GaN / Si晶片粘合到Si(100)晶片中,以防止其捕获气泡。通过快速原子光束蚀刻从背面缩短粘合的GaN层以去除缓冲层并产生肋波导。测量了GaN微耦合谐振器的传输特性。将直波导的损失测量为4.0 +/- 1.7dB / mm,围绕1.55μm的波长。微鸟半径范围为30至60μm,其中测量的自由光谱范围从2.58变化到5.30nm。微鸟波导谐振器的质量因素为1710至2820.(c)2018年光学学会

著录项

  • 来源
    《Applied optics》 |2018年第9期|共7页
  • 作者单位

    Tohoku Univ Dept Finemech Sendai Miyagi 9808579 Japan;

    Tohoku Univ Dept Finemech Sendai Miyagi 9808579 Japan;

    Tohoku Univ Dept Finemech Sendai Miyagi 9808579 Japan;

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