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A three-dimensional vertically aligned functionalized multilayer graphene architecture: An approach for graphene-based thermal interfacial materials

机译:三维垂直对齐的功能化多层石墨烯结构:基于石墨烯的热界面材料的方法

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摘要

Thermally conductive functionalized multilayer graphene sheets (fMGs) are efficiently aligned in large-scale by a vacuum filtration method at room temperature, as evidenced by SEM images and polarized Raman spectroscopy. A remarkably strong anisotropy in properties of aligned fMGs is observed. High electrical (~386 S cm~(-1)) and thermal conductivity (~112 W m~(-1) K~(-1) at 25 °C) and ultralow coefficient of thermal expansion (~-0.71 ppm K~(-1)) in the in-plane direction of A-fMGs are obtained without any reduction process. Aligned fMGs are vertically assembled between contacted silicon/silicon surfaces with pure indium as a metallic medium. Thus-constructed three-dimensional vertically aligned fMG thermal interfacial material (VA-fMG TIM) architecture has significantly higher equivalent thermal conductivity (75.5 W m~(-1) K~(-1)) and lower contact thermal resistance (5.1 mm~2 K W~(-1)), compared with their counterpart from A-fMGs that are recumbent between silicon surfaces. This finding provides a throughout approach for a graphene-based TIM assembly as well as knowledge of vertically aligned graphene architectures, which may not only facilitate graphenes application in current demanding thermal management but also promote its widespread applications in electrodes of energy storage devices, conductive polymeric composites, etc.
机译:SEM图像和偏振拉曼光谱证明,在室温下,通过真空过滤方法可将导热功能化的多层石墨烯片(fMG)有效地进行大规模对准。观察到排列的fMG的性质具有非常强的各向异性。高电(〜386 S cm〜(-1))和热导率(在25°C时为〜112 W m〜(-1)K〜(-1))和超低热膨胀系数(〜-0.71 ppm K〜 (-1))在没有任何还原过程的情况下获得了A-fMG的面内方向。对齐的fMG垂直组装在接触的硅/硅表面之间,并以纯铟作为金属介质。这样构造的三维垂直排列的fMG热界面材料(VA-fMG TIM)体系结构具有明显更高的等效热导率(75.5 W m〜(-1)K〜(-1))和更低的接触热阻(5.1 mm〜 2 KW〜(-1)),与硅表面之间的A-fMG的对应功率相比。这一发现为基于石墨烯的TIM组件提供了完整的方法,并为垂直排列的石墨烯架构提供了知识,这不仅可以促进石墨烯在当前苛刻的热管理中的应用,而且可以促进其在储能设备,导电聚合物中的广泛应用。复合材料等

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