Three-dimensional deformation measurement from the combination of in-plane and out-of-plane electronic speckle pattern interferometers

摘要

An optical setup that can be switched to produce in-plane and out-of-plane sensitivity interferometers was designed for three-dimensional deformation measuring by electronic speckle pattern interferometry. Divergent illumination is considered in the evaluation of sensitivity vectors to measure both in-plane and out-of-plane displacement components. The combination of these interferometers presents the advantage of greater sensitivity in directions u, v, and w than a typical interferometer with three illumination beams provides. The system and its basic operation are described, and results with an elastic target that is exposed to a mechanical load are reported.