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Use of dynamic electronic speckle pattern interferometry with the Hilbert transform method to investigate thermal expansion of a joint material

机译:使用动态电子散斑图干涉法和希尔伯特变换方法研究接头材料的热膨胀

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摘要

A dynamic electronic speckle pattern interferometry method is applied to investigate thermal expansion of a joint material (ceramic-stainless steel) as a practical industrial object. The speckle interference signal is considered in the temporal domain and the phase is analyzed by the Hilbert transform method. Errors caused by the bias and modulation variations over the phase values are first examined by numerical simulation. Two experiments are performed with in-plane and out-of-plane sensitive systems to study the 3D deformation field thoroughly. The deformation field showed clearly the difference between the thermal expansions of the stainless steel and ceramic. It was also revealed that the boundary of materials and its vicinity suffer very large thermal strain due to the significantly large difference in the linear coefficient of thermal expansions.
机译:动态电子散斑图案干涉法被用于研究作为实际工业对象的接合材料(陶瓷-不锈钢)的热膨胀。在时域中考虑斑点干扰信号,并通过希尔伯特变换方法分析相位。首先通过数值模拟检查由相位值上的偏置和调制变化引起的误差。使用平面内和平面外敏感系统进行了两个实验,以全面研究3D变形场。变形场清楚地显示出不锈钢和陶瓷的热膨胀之间的差异。还发现由于热膨胀线性系数的显着大差异,材料的边界及其附近受到很大的热应变。

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