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首页> 外文期刊>Thin Solid Films >Nitridation of atomic-layer-deposited HfO_2/Al_2O_3 stacks by NH_3 annealing
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Nitridation of atomic-layer-deposited HfO_2/Al_2O_3 stacks by NH_3 annealing

机译:NH_3退火氮化原子层沉积的HfO_2 / Al_2O_3堆

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摘要

HfO_2/Al_2O_3 stacks are grown on Si (100) substrate by atomic layer deposition and then nitridized using ammonia (NH_3) annealing in the temperature range of 600-900 ℃. The effects of NH_3 annealing temperature on the structural and physical properties are investigated. HfO_2 phase changes from monoclinic to orthorhombic with the annealing treatment. Moreover, the increasing of the grain size and decreasing of the valence band maximum with increasing annealing temperature are demonstrated. In addition, the film annealed at 900 ℃ clearly shows that there exists an amorphous Al_2O_3 layer between partially crystalline HfO_2 layer and the Si substrate.
机译:HfO_2 / Al_2O_3叠层通过原子层沉积在Si(100)衬底上生长,然后在600-900℃的温度范围内使用氨(NH_3)退火氮化。研究了NH_3退火温度对结构和物理性能的影响。通过退火处理,HfO_2相从单斜晶向正交晶变。此外,随着退火温度的升高,晶粒尺寸增大,价带最大值减小。另外,在900℃退火的薄膜清楚地表明,在部分结晶的HfO_2层与Si衬底之间存在非晶Al_2O_3层。

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  • 来源
    《Thin Solid Films》 |2013年第1期|230-233|共4页
  • 作者单位

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

    State Key Laboratory of ASIC and System, Department of Microelectronics, Fudan University, Shanghai 200433, PR China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    HfO_2/Al_2O_3 stacks; high-k dielectric; NH_3 annealing;

    机译:HfO_2 / Al_2O_3堆栈;高介电常数NH_3退火;

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