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Laser induced localised hydrogen passivation

机译:激光诱导的局部氢钝化

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Hydrogen passivation is considered as an effective way to reduce the recombination ability of low cost silicon wafer. In this paper, an innovative method to use laser to achieve localised hydrogen passivation is proposed. Laser induced localised hydrogen passivation is shown to be able to passivate localised high recombination sites, and therefore enhance the photoluminescence response and effective lifetime of the silicon wafer. In the experiment, various processing parameters on the effect of localised hydrogen passivation are investigated. It is found that the performance of localised hydrogen passivation increases with the laser induced peak temperature and laser illumination intensity until the critical value. The performance of localised hydrogen passivation is also found to increase with the decreased laser scan speeds, as reduced laser scan speeds lead to enhanced hydrogen passivation time. (C) 2015 Elsevier Ltd. All rights reserved.
机译:氢钝化被认为是降低低成本硅晶片的重组能力的有效方法。本文提出了一种利用激光实现局部氢钝化的创新方法。显示激光诱导的局部氢钝化能够钝化局部的高复合位点,因此增强了硅晶片的光致发光响应和有效寿命。在实验中,研究了各种工艺参数对局部氢钝化的影响。发现随着激光诱导的峰值温度和激光照射强度直至临界值,局部氢钝化的性能增加。还发现局部氢钝化的性能随着激光扫描速度的降低而提高,因为降低的激光扫描速度会导致氢钝化时间的增加。 (C)2015 Elsevier Ltd.保留所有权利。

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