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Thermal fatigue test of electronic packages under temperature cycles

机译:电子封装在温度循环下的热疲劳测试

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摘要

Equipment has been developed with which almost rectangle temperature cycles can be carriednout. The drop-down of electric voltage for each chip in an electronic package is recorded for thenthermal cycles. From the SEM observation of the specimens cut from the chips endured differentntemperature cycles, it is found that there is a strong interrelation between the fatigue damage andnthe drop-down value of electric voltage. It is also noticed that when the fatigue crack initiates fromnthe interface edges, the drop-down value will increase dramatically. An experimental criterion fornthe evaluation of chip’s fatigue life based on the drop-down of electric voltage is proposed. Thenfatigue life of different chips is obtained under different temperature cycles from the criterion.
机译:已经开发出可以进行几乎矩形的温度循环的设备。记录电子封装中每个芯片的电压降,然后进行热循环。从切屑切割的样品的SEM观察结果可知,样品经受了不同的温度循环,疲劳损伤与电压下降值之间存在很强的相互关系。还应注意,当疲劳裂纹从界面边缘开始时,下拉值将急剧增加。提出了一种基于电压降评估芯片疲劳寿命的实验标准。然后根据该标准获得了在不同温度循环下不同芯片的疲劳寿命。

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