Measurement of residual stresses by X-ray diffraction techniques in pyrite films prepared by magnetron sputtering

摘要

Pyrite films were prepared by magnetron sputtering and sulphuration treatment. The residualnstresses in the pyrite films were studied as a function of sulphuration temperature. Thenmicrostructure was investigated by atomic force microscopy (AFM). The measurement wasnperformed with a h–2h mode glancing incidence X-ray diffraction (XRD) instrument. The residualnstresses were calculated by using sin2 y method. The intrinsic stresses were estimated from thendifference of the sulphurised pyrite films lattice constant and stress free pyrite films latticenconstant. The thermal stresses were obtained from the empirical formula. The experimental resultsnindicate that residual stresses stored in the pyrite films are compressive and the value of residualnstresses decreases from 100 to 79 MPa with increasing sulphuration temperature from 623 ton873 K. The intrinsic stresses in the pyrite films are comprehensive and decrease with increasingnsulphuration temperature. In contrast, the thermal stresses in pyrite films are tensile and tend tonincrease with sulphuration temperature.