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Numerically validated reduced-order model for laminates containing shape memory alloy wire meshes

机译:包含形状记忆合金丝网的层压板的数字验证降阶模型

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摘要

The incorporation of active materials into composites is an active area of research. However, the design and optimization of such composites is challenging because detailed analysis using finite element analysis (FEA) is computationally intensive. This work presents a new reduced-order model for laminates containing shape memory alloy (SMA) wire meshes that significantly reduces the computational burden on design analysis while maintaining good accuracy. The approach is based on a foundation of classical laminated plate theory (CLPT). It considers fully non-linear stress distributions and incorporates a detailed phenomenological model of the hysteretic SMA constitutive behavior. The reduced-order CLPT-based model and its numerical implementation are fully described and unique laminate responses are presented. The model is validated against a corresponding high-fidelity FEA model of an SMA-based laminate. The reduced-order model produces accurate predictions at significantly less expense than the high-fidelity FEA approach, with normalized root-mean-squared error below 10% for most design cases.
机译:将活性材料掺入复合材料是研究的活跃领域。但是,由于使用有限元分析(FEA)进行详细分析的计算量很大,因此此类复合材料的设计和优化面临挑战。这项工作为包含形状记忆合金(SMA)丝网的层压板提供了一种新的降阶模型,该模型可以显着减少设计分析的计算负担,同时保持良好的精度。该方法基于经典层压板理论(CLPT)的基础。它考虑了完全非线性的应力分布,并纳入了滞回SMA本构行为的详细现象学模型。完整描述了基于降阶CLPT的模型及其数值实现,并提出了独特的层板响应。该模型已针对基于SMA的层压板的相应高保真FEA模型进行了验证。与高保真FEA方法相比,降阶模型产生的准确预测费用要低得多,在大多数设计情况下,归一化均方根误差均低于10%。

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