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机译:铜柱凸点下金属化对倒装焊点电迁移的电流拥挤和焦耳热效应的影响
Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan;
Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan;
Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan;
Institute of Microelectromechanical System, National Tsing Hua University, Hsin-chu 30013, Taiwan;
Research Center for Applied Sciences, Academia Sinica, Taipei, 11529, Taiwan;
Central Laboratories, Advanced Semiconductor Engineering, Inc., Kao-hsiung 811, Taiwan;
机译:痕量Al对加速电迁移下倒装芯片焊点焦耳热和电流拥挤的影响
机译:电流拥挤和焦耳热对室温下测试的倒装芯片复合焊点中电迁移引起的失效的影响
机译:倒装芯片Sn-0.7Cu焊点电迁移过程中电流拥挤引起的不均匀和负向标记位移
机译:铜柱对倒装芯片焊点电迁移中电流拥挤效应的影响
机译:热电迁移对倒装芯片无铅焊点中铜溶解和金属间化合物形成的影响
机译:基于离散空隙形成的倒装芯片焊点失效的电迁移机理
机译:Cu / In / Cu倒装芯片联合系统中焊接电迁移的研究