Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves

摘要

In an adhesively bonded structure, utilizing the adhesive itself for monitoring the joint integrity can be beneficial in reduction of labor, time, and potential human errors while avoiding problems associated with introduction of a foreign sensor component. This work started from the examination of effective piezoelectricity of commercial structural adhesives/sealants, and five of them were found to possess effective piezoelectric property, with effective piezoelectric coefficient d(33) from -0.11 to -1.77 pm/V depending on frequency under substrate clamping condition. With stable piezoelectric response at least up to megahertz, an epoxy adhesive with inorganic filler was selected for structural health monitoring (SHM) feasibility demonstration via generating or sensing guided ultrasonic Lamb waves. The presence of disbond in the adhesive joint is detectable by comparing the Lamb waves signal with a reference baseline signal associated with an intact structure. The results show that the selected adhesive with piezoelectric response can perform the dual roles of structural bonding and ultrasonic joint integrity monitoring.