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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >A model for the theoretical characterization of thin piezoceramicrings
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A model for the theoretical characterization of thin piezoceramicrings

机译:薄压电陶瓷的理论表征模型

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This work describes a matrix model of the radial mode of a thinnpiezoceramic ring capable of predicting the dynamic behavior when thentwo main surfaces are stress free, while the lateral, inner, and outernare loaded by an external medium. The ring is modeled as a three-portnsystem with two mechanical ports and one electrical port. With thisnapproach it is easy to compute the resonance frequency spectrum, thenradial displacement, and the electric impedance of a thin ring. Goodnagreement between the computed and the measured electric impedance isnfound. The resonance frequency spectrum is computed as a function of theninner-to-outer radius ratio G: when the inner radius vanishes, thenresonances of the ring coincide with those of a disk, while, increasingnG up to one, the first-mode frequencies decrease approaching the valuenobtained with a lumped mode model. The frequencies of the higher-ordernmodes, on the other hand, increase to infinity, justifying the lumpednmode approximation. The spatial distribution of the displacement in thenradial direction is also computed; it has a Bessel function shape which,nas expected, becomes linear by increasing the inner radius. Finally, thenbehavior of the effective coupling factor keff with G isnexamined. It is shown that, when G→1, keff approachesnthe material coupling factor k31, while when G→0,nkeff is proportional to the planar coupling factor kpn. Further it is shown that for G>0.6, the approximation of thenring to a lumped mode system is quite acceptable
机译:这项工作描述了薄压电陶瓷环的径向模式的矩阵模型,该模型能够预测两个主表面没有应力而外侧,内部和外部由外部介质加载时的动态行为。将该环建模为具有两个机械端口和一个电端口的三端口系统。通过这种方法,可以很容易地计算出共振频谱,径向位移和细环的电阻抗。找到计算的和测量的电阻抗之间的良好一致性。共振频谱的计算是内外半径比G的函数:当内半径消失时,环的共振与圆盘的共振相吻合,而当增加nG到一个时,第一模态频率降低,接近集总模式模型获得的值。另一方面,高阶模的频率增加到无穷大,证明了集总模近似。还计算了沿径向的位移的空间分布。它具有贝塞尔(Bessel)函数形状,可以通过增加内半径使之达到预期的线性。最后,检验了有效耦合因子keff与G的行为。结果表明,当G→1时,keff接近材料耦合因子k31,而当G→0时,nkeff与平面耦合因子kpn成正比。进一步表明,对于G> 0.6,折合到集总模式系统的近似值是完全可以接受的

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