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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Ultrasonic waveguide applicator arrays for interstitial heating: a model study
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Ultrasonic waveguide applicator arrays for interstitial heating: a model study

机译:用于间隙加热的超声波波导敷料器阵列:模型研究

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In this paper we describe an ultrasonic waveguide multiapplicator array for interstitial heating. We first discuss the heat generation term common for this type of applicator and show that the radius of the applicator is the limiting factor in the pattern of heat deposition. We carry out finite element analysis simulations of temperature profiles for three- and four-applicator array, and we test the simulations by measurements in a large volume tissue phantom. With the positive result of this test, we use the simulations to evaluate the size of the heated volume for several applicators (three to six) and for various geometries of their positioning. We do the simulations for a range of the effective thermal conductivity and for two applicator diameters. The volume of the medium with temperatures above 42/spl deg/C was in the 25 to 73 cm/sup 5/ range. This volume increased linearly with the diameter of the boundary at the basal temperature. Power required to produce preselected temperature elevation increased monotonically with the effective thermal conductivity. With the 24 mm between the applicators, the array could elevate the temperature to the required value up to the 0.030 W/cm/K effective thermal conductivity.
机译:在本文中,我们描述了用于间隙加热的超声波导倍增器阵列。我们首先讨论该类型涂药器常见的生热术语,并表明涂药器的半径是热沉积模式的限制因素。我们对三个和四个涂敷器阵列的温度曲线进行了有限元分析模拟,并通过在大体积组织体模中进行测量来测试模拟。有了这个测试的积极结果,我们使用模拟来评估几个施加器(3到6个)的加热容积的大小以及它们放置的各种几何形状。我们针对有效导热率范围和两个施涂器直径进行了仿真。温度高于42 / spl℃/℃的介质体积在25至73 cm / sup 5 /范围内。该体积随基础温度下边界的直径线性增加。产生预选温度升高所需的功率随有效导热率单调增加。在施加器之间有24 mm的距离时,阵列可以将温度升高到所需值,最高可达到0.030 W / cm / K的有效热导率。

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