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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Application of RF Varactor Using BaxSr1-xTiO3/TiO2/HR-Si Substrate for Reconfigurable Radio
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Application of RF Varactor Using BaxSr1-xTiO3/TiO2/HR-Si Substrate for Reconfigurable Radio

机译:BaxSr1-xTiO3 / TiO2 / HR-Si衬底的射频变容二极管在可重构无线电中的应用

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摘要

In this paper, the potential feasibility of integrating BaxSr1-xTiO3 (BST) films into Si wafer by adopting tunable interdigital capacitor (IDC) with TiO2 thin film buffer layer and a RF tunable active bandpass filter (BPF) using BST based capacitor are proposed. TiO2 as a buffer layer is grown onto Si substrate by atomic layer deposition (ALD) and the interdigital capacitor on BST(500 nm)/TiO2(50 nm)/HR-Si is fabricated. BST interdigital tunable capacitor integrated on HR-Si substrate with high tunability and low loss tangent are characterized for their microwave performances. BST/TiO2/HR-Si IDC shows much enhanced tunability values of 40% and commutation quality factor (CQF) of 56.71. A resonator consists of an active capacitance circuit together with a BST varactor. The active capacitor is made of a field effect transistor (FET) that exhibits negative resistance as well as capacitance. The measured second order active BPF shows bandwidth of 110 MHz, insertion loss of about 1 dB at the 1.81 GHz center frequency and tuning frequency of 230 MHz (1.81-2.04 GHz).
机译:本文提出了采用带有TiO2薄膜缓冲层的可调谐叉指电容器(IDC)和使用基于BST的电容器的RF可调谐有源带通滤波器(BPF)将BaxSr1-xTiO3(BST)膜集成到Si晶片中的潜在可行性。通过原子层沉积(ALD)将TiO2作为缓冲层生长到Si衬底上,并在BST(500 nm)/ TiO2(50 nm)/ HR-Si上制造叉指电容器。集成在HR-Si基板上的BST叉指可调电容器具有很高的可调性和低损耗角正切,具有微波性能。 BST / TiO2 / HR-Si IDC的可调谐性值提高了40%,换向品质因数(CQF)为56.71。谐振器由有源电容电路和BST变容二极管组成。有源电容器由具有负电阻和电容的场效应晶体管(FET)制成。测得的二阶有源BPF显示带宽为110 MHz,中心频率为1.81 GHz时插入损耗约为1 dB,调谐频率为230 MHz(1.81-2.04 GHz)。

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