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Use of fluorine-doped silicon oxide for temperature compensation of radio frequency surface acoustic wave devices

机译:掺氟氧化硅在射频表面声波装置的温度补偿中的应用

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This paper investigates acoustic properties, including the temperature coefficient of elasticity (TCE), of fluorine-doped silicon oxide (SiOF) films and proposes the application of the films to the temperature compensation of RF SAW devices. From Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. We fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO3-substrate structure, and evaluated their performance. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO2-based films even when the dopant is added. In comparison with pure SiO2 with the film thickness h of 0.3 wavelengths (λ), TCF was improved by 7.7 ppm/°C without deterioration of the effective electromechanical coupling factor K2 when r = 3.8 atomic % and h = 0.28λ. Fluorine inclusion did not obviously influence the resonators' Q factors when r <; 8.8 atomic %.
机译:本文研究了掺氟氧化硅(SiOF)薄膜的声学特性,包括弹性温度系数(TCE),并提出将其应用于RF SAW器件的温度补偿。根据傅立叶变换红外光谱法(FT-IR),预计SiOF膜具有良好的TCE性能。我们使用SiOF-覆盖层/ Cu-光栅/ LiNbO 3 -衬底结构制造了一系列声表面波器件,并对其性能进行了评估。实验表明,频率频率系数(TCF)随着氟含量r的增加而增加,正如我们从FT-IR测量所期望的那样。这意味着即使添加了掺杂剂,通过FT-IR测得的Si-O-Si原子结构也决定了SiO 2 基薄膜的TCE行为。与具有0.3波长(λ)的膜厚h的纯SiO 2 相比,当r = 3.8原子%时,TCF提高了7.7 ppm /°C,而有效机电耦合系数K2不变。 h =0.28λ。当r <时,氟的夹杂并没有明显影响谐振器的Q因子。 8.8原子%。

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