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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Single-resonator dual-frequency AIN-on-Si MEMS oscillators
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Single-resonator dual-frequency AIN-on-Si MEMS oscillators

机译:单谐振器双频率AIN-on-Si MEMS振荡器

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This paper reports on the design, implementation, and phase-noise optimization of low-power interface IC for dual-frequency oscillators that utilize two high quality factor (Q) width-extensional bulk acoustic modes of the same AlN-on-silicon resonator. Two 0.5-μm CMOS transimpedance amplifiers (TIA) have been designed, characterized, and interfaced with two dual-mode resonators operating at 35.5/105.7 MHz (first/third order modes) and 35.5/174.9 MHz (first/ fifth order modes). One TIA uses open-loop regulated cascode (RGC) topology in the first stage to enable low power operation, whereas the second one uses an inverter with shunt-shunt feedback to deliver higher gain with lower phase noise. An on-chip switching network is incorporated into each TIA to change the oscillation frequency based on the different phase shift. The effect of TIA on the phase-noise performance of oscillators is studied and compared for both topologies. The measured phase noise of low- and high-frequency modes at 1 kHz offset from carrier are ???114 and ???108 dBc/Hz for the 35/105 MHz oscillator, and ???108 and ???105 dBc/Hz for the 35/175 MHz oscillator, respectively, whereas the far-from-carrier reaches below ???140 dBc/Hz in all cases.
机译:本文报告了双频振荡器的低功耗接口IC的设计,实现和相位噪声优化,该双频振荡器利用了同一AlN-on-silicon谐振器的两个高品质因数(Q)宽度扩展体声模式。已经设计,表征了两个0.5μmCMOS跨阻放大器(TIA),并与两个工作在35.5 / 105.7 MHz(一阶/三阶模式)和35.5 / 174.9MHz(一阶/五阶模式)的双模谐振器接口。一个TIA在第一阶段使用开环稳压共源共栅(RGC)拓扑来实现低功耗工作,而第二个TIA使用具有并联反馈的逆变器来提供更高的增益和更低的相位噪声。每个TIA中都集成了一个片上开关网络,以根据不同的相移来改变振荡频率。研究了TIA对振荡器的相位噪声性能的影响,并比较了两种拓扑。对于35/105 MHz振荡器,在距载波1 kHz偏移处测得的低频和高频模式的相位噪声为114和108 dBc / Hz,108和105 dBc对于35/175 MHz振荡器,频率分别为/ Hz,而在所有情况下,远离载波的频率均低于140 dBc / Hz。

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