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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Side-Supported Radial-Mode Thin-Film Piezoelectric-on-Silicon Disk Resonators
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Side-Supported Radial-Mode Thin-Film Piezoelectric-on-Silicon Disk Resonators

机译:侧面支撑的径向模式薄膜压电硅圆盘谐振器

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In this paper, anisotropy of single-crystalline silicon (SCS) is exploited to enable side-supported radial-mode thin-film piezoelectric-on-substrate (TPoS) disk resonators. In contrast to the case for isotropic material, it is demonstrated that the displacement of the disk periphery is not uniform for the radial-mode resonance in SCS disks. Specifically, for high-order harmonics, nodal points are formed on the edges, creating an opportunity for placing suspension tethers and enabling side-supported silicon disk resonators at the very high-frequency band with negligible anchor loss. In order to thoroughly study the effect of material properties and the tether location, anchor loss is simulated using a 3-D perfectly matched layer in COMSOL. Through modeling, it is shown that eighth-harmonic sidesupported SCS disk resonators could potentially have orders of magnitude lower anchor loss in comparison to their nanocrys-talline diamond (NCD) disk resonator counterparts given the tethers are aligned to the [100] crystalline plane of silicon. It is then experimentally demonstrated that in TPoS disk, resonators fabricated on an 8-mu m silicon-on-insulator (SOI) wafer, unloaded quality factor improves from similar to 450 for the second-harmonic mode at 43 MHz to similar to 11500 for the eighth-harmonic mode at 196 MHz if tethers are aligned to [100] plane. The same trend is not observed for NCD disk resonators and SCS disk resonators with tethers aligned to [110] plane. Finally, the temperature coefficient of frequency is simulated and measured for the radial-mode disk resonators fabricated on the 8-mu m-thick degenerately n-type doped SCS, and the TFC data are utilized to guarantee proper identification of the harmonic radial-mode resonance peaks among others.
机译:在本文中,单晶硅(SCS)的各向异性被用来实现侧支撑径向模式薄膜压电基片压电(TPoS)磁盘谐振器。与各向同性材料的情况相反,已证明,对于SCS磁盘中的径向模式共振,磁盘外围的位移不均匀。具体而言,对于高次谐波,节点在边缘处形成,这为放置悬挂系绳提供了机会,并使侧面支撑的硅盘谐振器能够在极高的频带上产生可忽略的锚固损耗。为了彻底研究材料特性和系绳位置的影响,使用COMSOL中的3D完美匹配层模拟了锚固损失。通过建模,结果表明,如果将系链对准晶体的[100]晶面,则八谐波侧支撑SCS磁盘谐振器与其纳米晶体-talline金刚石(NCD)磁盘谐振器相比,其锚固损耗可能会降低几个数量级。硅。然后通过实验证明,在TPoS磁盘中,在8微米绝缘体上硅(SOI)晶片上制造的谐振器的空载品质因数从43 MHz的二次谐波模式的450改善到11500的11500。如果系链与[100]平面对齐,则在196 MHz时处于八次谐波模式。对于NCD磁盘谐振器和系链对准[110]平面的SCS磁盘谐振器,未观察到相同的趋势。最后,对在8μm厚的简并n型掺杂SCS上制造的径向模式盘谐振器的频率温度系数进行了仿真和测量,并利用TFC数据来确保正确识别谐波径向模式共振峰。

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