Modeling via hole grounds in microstrip

Golfarb M.E.; Pucel R.A.

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Modeling via hole grounds in microstrip

机译：通过微带中的孔接地进行建模

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摘要

A simple model for a cylindrical via hole in a microstrip is presented. The model is based on a modification of the inductance of a cylindrical conductor as derived from Maxwell's equations. The model was verified experimentally, and is corroborated by other solutions using numerical techniques.

机译：提出了微带中圆柱形通孔的简单模型。该模型基于对圆柱导体的电感的修改，该修改是根据麦克斯韦方程式得出的。该模型已通过实验验证，并通过使用数值技术的其他解决方案得到了证实。

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《IEEE Microwave and Guided Wave Letters》 |1991年第6期|P.135-137|共3页
作者
Golfarb M.E.; Pucel R.A.;
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正文语种 eng
中图分类无线电电子学、电信技术;
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专利

1. Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique [J] . Sorrentino R., Alessandri F. IEEE Transactions on Microwave Theory and Techniques . 1992,第12期

机译：微带通孔接地全波建模的三维模式匹配技术
2. Microstrip broadband thin-film attenuators without via-hole-ground at millimeter wave frequencies [J] . Aja Beatriz, Artal Eduardo, Villa Enrique, AEU: Archiv fur Elektronik und Ubertragungstechnik: Electronic and Communication . 2019,第期

机译：微带宽带薄膜衰减器，无电孔 - 灯泡磨削距毫米波频率
3. Improved microstrip hairpinline bandpass filter using via ground holes and capacitive gap [J] . Hasan Azhar, Hannan Abdul, Nadeem Ahmed Ejaz Analog Integrated Circuits and Signal Processing . 2016,第2期

机译：使用通孔和电容间隙的改进型微带发夹线带通滤波器
4. Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique [C] . Alessandri, F., Mongiardo, . 1992

机译：三维模式匹配技术对微带中通孔接地的全波建模
5. Analytical formulation of truncated, grounded substrate effects for development of fast, iterative CAD algorithms for modeling microstrip patch antennas [D] . Chettiar, Edwin. 2007

机译：用于建立微带贴片天线建模的快速迭代CAD算法的截断接地基体效应的分析公式
6. Differential Microfluidic Sensors Based on Dumbbell-Shaped Defect Ground Structures in Microstrip Technology: Analysis Optimization and Applications [O] . Paris Vélez, Jonathan Muñoz-Enano, Marta Gil, 2019

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7. Microstrip broadband thin-film attenuators without via-hole-ground at millimeter wave frequencies [O] . Beatriz Aja, Eduardo Artal, Enrique Villa, 2019

机译：微带宽带薄膜衰减器，没有通孔 - 灯泡磨削距毫米波频率
8. Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages [R] . Ponchak, George E., Chun, Donghoon, Katehi, Linda P. B., 1999

机译：利用金属填充通孔栅栏实现LTCC封装微带线串扰控制的实验验证

Modeling via hole grounds in microstrip

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