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机译:脉冲大电流功率循环中IGBT模块中固晶焊点的失效机理
Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Powe, Wuhan 430033, Hubei, Peoples R China;
Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Powe, Wuhan 430033, Hubei, Peoples R China;
Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Powe, Wuhan 430033, Hubei, Peoples R China;
Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Powe, Wuhan 430033, Hubei, Peoples R China;
Cross section; die-attach solder joint; insulated-gate bipolar transistor (IGBT); interface detachment; physics of failure; power cycling; pulse high current;
机译:加速老化下IGBT中的模具接头失效的物理:无铅焊料合金中微缺陷的演变
机译:窄结温度循环对IGBT模块中固晶焊层影响的实验研究
机译:电力循环测试期间电力半导体模块的模具接头中的疲劳裂缝网络和试验参数对关节疲劳寿命的影响
机译:大功率IGBT模块在热循环和功率循环期间的应力分布和失效模式的比较
机译:加速热循环和功率循环下带鸥翼引线的四方扁平封装的焊点设计优化
机译:基于离散空隙形成的倒装芯片焊点失效的电迁移机理
机译:SN3.0AG0.5CU / Cu焊点下剪切热循环下的故障特性及损伤机理