Addressing Product Miniaturization Challenges for Medical Electronics

摘要

With the rapid deployment of new products from an ever growing number of competing companies, time-to-market can be the difference between leading and following. For that reason, many manufacturers will rely heavily on more innovative package solutions that minimize overall package size as well as integrate a number of already proven functional elements within a single-package outline. The challenge the medical electronic developer faces when competing in this very specialized field is to offer a product that will meet all performance and functionality expectations in a form factor that is significantly smaller and lighter than the product it's replacing. Simultaneously, the newer generations of electronic assemblies